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AN926 APPLICATION NOTE Brand Traceability with ZEROPOWER(R) and TIMEKEEPER (R) INTRODUCTION To insure traceability to specific assembly and test operations, ST clearly brands a date code on every device, an encapsulation code on CAPHATTM products, and the fab lot number on all SOIC products. The 9-character date code (Figure 1) is positioned at the top of the label, beside the ST logo. This presents a complete facility identification, as well as a final-test time-line of the device's manufacturing process. The 5- to 8-character encapsulation code (CAPHAT only; Figure 2) is positioned at the end of the device and is placed perpendicularly to the date code. It summarizes details of the encapsulation process. Figure 1. Date Code H 9 9 1 A 97 01 Wafer Fab H: Carrollton Fab O: Other Assembly Site 9: Muar D: Dallas Test Site 9: Muar D: Dallas Lot Designator 1A to 9Z AI02442 Work Week Started Assembly 01, 05, 09 ... Year Started Assembly double digit: 97, 98, 99, 00, ... single digit: 1, 2, 3, ... Figure 2. Encapsulation Code (CAPHATTM only) A HT 1117 X Assembly A: Automatic (machine) W: Welded process blank: Manual process Test Temperature HT: 85 C blank: Standard test temp. Julian Date (when Lot underwent Encapsulation process) e.g. 1117 = 111th day of 1997 Sequential Lot ID by Product Type AI02443 February 2002 1/2 AN926 - APPLICATION NOTE The 7-character code (SOIC only; Figure 3) is positioned in the bottom line closest to Pin 1 on the device. It represents the lots' overall fabrication history. Figure 3. Fab Lot Number H925123 Wafer Fab H: Carrollton Fab Individual Lot Numbers Year Start Assembly last digit of the year, single digit: 0, 1, 2, ... Work Week Started Assembly double digits: 01, 02, 03, ... AI06379 CONTACT INFORMATION If you have any questions or suggestions concerning the matters raised in this document, please send them to the following electronic mail addresses: apps.nvram@st.com ask.memory@st.com (for application support) (for general inquiries) Please remember to include your name, company, location, telephone number, and fax number. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics All other names are the property of their respective owners. (c) 2002 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. www.st.com 2/2 |
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